Point Autofocus Probe 3D Measuring Instrument

NH-3Ns

Standard model of NH-Series

Ultra-precision point autofocus probe 3D measuring instrument

NH-3SPs

The highest-end model of NH-Series (with 1nm scale resolution)

MLA form / optical characteristic evaluation instrument

NH-3MAs

The total evaluation from process to image formation performance

Nozzle inner diameter / depth measuring instrument

NH-3NZ

High precision automatic measurement of nozzle diameters and depths without destruction!

Point Autofocus Probe 3D Measuring Instrument

NH-4Ns

The perfect solution for densified and large-scaled semiconductor quality control

Point autofocus proble large 3D measuring instrument

NH-5Ns

The perfect solution for large-scaled heavy-load workpieces, such as precision tools

Information

Contact

We welcome your inquiry by telephone / fax / information request form.

High NA aspheric surface measuring unit

Stitching measurement method offers sub-micrometer measurement of over 60°slope.

Nomarski differential interference observation

Observation of surface roughness and scratches of several angstrom level.

Temperature control thermostat chamber

High precision measurement of a workpiece deformation under temperature fluctuation.

Wafer holder

Pneumatic power chuck type high precision wafer holder is exclusively designed for NH Series.

6-inch automatic θ stage

Improving operability of measurement and offering easy setting of a workpiece.

Measuring Principle and Features

Autofocusing system which is immune to surface textures of workpieces

Main Features

Mitaka laser probe 3D measuring instruments are user-friendly systems which offer high-precision measurement

NH Series Video Library

NH Series measures and evaluates various workpieces

Standard Software

NH Standard Software

NH software carries out multipurpose measurement

3D Surface Texture Analysis & Evaluation Software

Mitaka Map

Mitaka Map extracts nano-unevenness from a large area

Image Processing Software

Mitaka Imager

Various image measuring & analysis software

Fresnel lens molding die

High precision measurement of a transparent lens with steep angles.

Grating

High speed and high precision measurements of sub-micrometer grooves.

Volume of solder

Volume and height evaluation of solder out of 3D surface.

Microlens array

Tracking rugged lens surface.

HDD head suspension

Measurement of delicate sample which easily distorts by one gentle touch.

High-density mounting board

Fine structure in a large area.

Surface of aspherical lens molding die

Diamond turning processed surface.

Fingerprint

High precision measurement of delicate material.

Human hair

Capturing fine structure.

Unevenness of evaporated metal film

High precision measurement of nano-meter level unevenness.

Diamond abrasive grain

Cutting edge profile and projection height measurements.

Tip of turning tool

Offering 3D view, size evaluation and roughness measurement.

BGA

Enhanced functions for profile and height measurements, coplanarity evaluation, etc.

Warpage and waviness of wafer

High speed measurement of total warpage and waviness of wafer.

Oblique incidence X-ray mirror

Measuring large sample in sub-micrometer level.

Grinding work surface

Calculating areal roughness out of measuring area.

Wear volume of brake pad

Separating burr / contact surface / wearing surface and calculating Abbott-Firestone curve.

Tooth flank of a precision gear

Form measurement and surface roughness evaluation of a precision gear.

End mill measurement

High precision measurement of outer diameter, rake angle and clearance angle out of profile data.

Precision micro punch

Easy measurement and evaluation of precision punch.

Contour form and edge measurements of drill

The laser probe offers quantitative measurement of tools in high precision.

Nozzle

Capable of measuring diameters / depths of small diameter nozzles such as inkjet, spinneret, etc.

Ultraprecision machining tool (Diamond Round cutting tool)

Capable of measuring tool blade edge which popular projection type tool measuring instruments cannot measure.