Measurement instruments
1990・93

Disk Tester
(Hard disk testing equipment)

3D Measurement System
AMS-5 sales started
1994・96

InterOpto Exhibition

3D Measuring Equipment NH-3 sales started
2000

PDI Specimen Engineering Systems

Started sales of 3D Measuring Instrument NH-3N

3D Measuring Equipment NH-3SP sales start

EUVL Exposure System
2002・04

Cross Section Roughness Measurement System
NH-120S sales started

Started sales of NH-3MA, microlens array shape/optical characteristic evaluation system
2007・09

Micro Contour Measuring Instrument
MLP-2 is now available

Immersion Shape Measuring Instrument
MP-3f sales started
2010・14

Surface Property Measurement System
PF-60 is now available

NH series equipped with "Scan AF function
2015

Full-Surface 3D Measuring Equipment
MLP-3 sales start
High precision mounting device of a vacuum suctioned chip

FAMIC-5R "Optical element mounting system"
Offering high precision mounting of a vacuumed chip by the inverted optical system

FAMIC-5M "High Output LD Chip Bonder"
Offering high precision positioning at one side face of a chip

FAMIC-5 "Fully Automatic Microchip Bonder"
Offering sub-micrometer level mounting of chips from 0.3mm to several millimeters in size.

FAMIC-3 "Fully Automatic Microchip Bonder"
Offering sub-micrometer level mounting of chips from 0.3mm to several millimeters in size.