Measurement instruments
1990・93
![](/company/images/industrial%201990-93_01.jpg)
Disk Tester
(Hard disk testing equipment)
![](/company/images/industrial%201990-93_02.jpg)
3D Measurement System
AMS-5 sales started
1994・96
![](/company/images/industrial%201994-96_01.jpg)
InterOpto Exhibition
![](/company/images/industrial%201994-96_02.jpg)
3D Measuring Equipment NH-3 sales started
2000
![](/company/images/industrial%202000_01.jpg)
PDI Specimen Engineering Systems
![](/company/images/industrial%202000_02.jpg)
Started sales of 3D Measuring Instrument NH-3N
![](/company/images/industrial%202000_03.jpg)
3D Measuring Equipment NH-3SP sales start
![](/company/images/industrial%202000_04.jpg)
EUVL Exposure System
2002・04
![](/company/images/industrial%202002-04_01.jpg)
Cross Section Roughness Measurement System
NH-120S sales started
![](/company/images/industrial%202002-04_02.jpg)
Started sales of NH-3MA, microlens array shape/optical characteristic evaluation system
2007・09
![](/company/images/industrial%202007-09_01.jpg)
Micro Contour Measuring Instrument
MLP-2 is now available
![](/company/images/industrial%202007-09_02.jpg)
Immersion Shape Measuring Instrument
MP-3f sales started
2010・14
![](/company/images/industrial%202010-14_01.jpg)
Surface Property Measurement System
PF-60 is now available
![](/company/images/industrial%202010-14_02.jpg)
NH series equipped with "Scan AF function
2015
![](/company/images/industrial%202015_01.jpg)
Full-Surface 3D Measuring Equipment
MLP-3 sales start
High precision mounting device of a vacuum suctioned chip
![](/company/images/main_famic-5R.png)
FAMIC-5R "Optical element mounting system"
Offering high precision mounting of a vacuumed chip by the inverted optical system
![](/company/images/main_famic-5M.png)
FAMIC-5M "High Output LD Chip Bonder"
Offering high precision positioning at one side face of a chip
![](/company/images/main_famic-5.png)
FAMIC-5 "Fully Automatic Microchip Bonder"
Offering sub-micrometer level mounting of chips from 0.3mm to several millimeters in size.
![](/company/images/main_famic-3.png)
FAMIC-3 "Fully Automatic Microchip Bonder"
Offering sub-micrometer level mounting of chips from 0.3mm to several millimeters in size.